-
RoboSense LiDAR wins CES 2019 Innovation Award for autonomous car technology
China: RoboSense, the world’s leading autonomous driving LiDAR perception solution provider, announced that it has been named a CES 2019 Innovation Awards Honoree for the RoboSense RS-IPLS Intelligent Perception LiDAR System
https://www.geospatialworld.net/new...novation-award-for-autonomous-car-technology/
---
Huaxing IC completed a $10 million Series A financing focused on high-performance crypto chips 华兴集成电路完成1000万美元A轮融资 专注于高性能密码芯片
http://finance.eastmoney.com/a/201901031019012936.html
----
Briefing: Chinese voice recognition startup AISpeech releases its first custom chip
Jan 4, 2019
The importance of this new chip is also connected to the fact that, in China, speech recognition is an increasingly competitive sector that has produced a number of important IA companies. In fact, AISpeech is not the only one. During the past year, some of these AI companies, including Unisound, Mobvoi and Rokid, have released their custom AI chips.
http://en.cifnews.com/aispeech-releases-first-custom-chip/
----
Photonic chip artificial intelligence to help "China chip" for overtaking
光子人工智能芯片助“中国芯”换道超车
2019-01-06 00:34 Beijing News
Operators force is 1000 times faster than traditional electronic artificial intelligence chip, but only one percent of its power consumption, low latency also anti-electromagnetic interference by university doctoral Tsinghua University, Peking University, Beijing Jiaotong University and other research and development of entrepreneurship photon artificial intelligence chip technology the realization of a lot of breakthroughs in the future can be widely used in mobile phones, autopilot, intelligent robotics, unmanned aerial vehicles and other fields. Recently, the photonic chip artificial intelligence project located in Shunyi, will this new technology to the fore.
"Chip design, processing, packaging, testing all completed in China, free from dependence on foreign high-lithography process is the core technology of the lane change chips overtaking." Research team leader Bai Bing said.
http://china.qianlong.com/2019/0106/3043670.shtml
----
Gowin Semiconductor Corp.’s Cumulative Shipments Reach 10 million pieces
January 02, 2019 21:00 ET | Source: GOWIN Semiconductor Corp.
SAN JOSE, Calif. and GUANGZHOU, China, Jan. 02, 2019 (GLOBE NEWSWIRE) -- Gowin Semiconductor Corp. (hereinafter referred to as "Gowin"), the world’s leading innovator of programmable logic devices, announces that its cumulative shipments have reached 10 million pieces. Among them, Gowin’s overall device sales in 2018 exceeded 8 million units, 8 times greater year over year compared to 2017.
In January 2017, Gowin shipped hundreds of FPGA devices for the first time. Since then, Gowin’s sales volume kept surging. By October 2018, the sales volume exceeded 1.2 million units per month. By the end of 2018, the annual sales volume exceeded 8 million pieces.
Up to now, Gowin has more than 400 FPGA customers worldwide, including more than 150 customers in Asia Pacific (China mainland excluded), Europe, and the United States. Customer markets cover a wide range of areas including communications, industrial, medical, LED display, video, broadcast, Internet of Things, artificial intelligence and consumer electronics.
"This is a very important milestone for us," said Jason Zhu, CEO of Gowin Semiconductor Corp. "Gowin is still in the early stage of development and we are very happy to achieve such results. This fully proves that our innovative and differentiated design ideas work. We will continue to make breakthroughs in product and technology innovation, and look forward to achieving further success in 2019."
https://globenewswire.com/news-rele...lative-Shipments-Reach-10-million-pieces.html
-------
high-performance anti-radiation hardened DSP chip released
数字信号处理芯片 “即墨芯”正式发布
11:03 on January 6, 2019
https://news.sina.com.cn/c/2019-01-06/doc-ihqfskcn4484772.shtml
----
First ToF Imager from China - image-sensors-world
Wuhan, China-based Silicon Integrated Inc. unveils SIF2310 that it calls "The first back-illuminated area array ToF sensor in China."
The SIF2310 integrates:
RoboSense LiDAR wins CES 2019 Innovation Award for autonomous car technology
China: RoboSense, the world’s leading autonomous driving LiDAR perception solution provider, announced that it has been named a CES 2019 Innovation Awards Honoree for the RoboSense RS-IPLS Intelligent Perception LiDAR System
https://www.geospatialworld.net/new...novation-award-for-autonomous-car-technology/
---
Huaxing IC completed a $10 million Series A financing focused on high-performance crypto chips 华兴集成电路完成1000万美元A轮融资 专注于高性能密码芯片
http://finance.eastmoney.com/a/201901031019012936.html
----
Briefing: Chinese voice recognition startup AISpeech releases its first custom chip
Jan 4, 2019
The importance of this new chip is also connected to the fact that, in China, speech recognition is an increasingly competitive sector that has produced a number of important IA companies. In fact, AISpeech is not the only one. During the past year, some of these AI companies, including Unisound, Mobvoi and Rokid, have released their custom AI chips.
http://en.cifnews.com/aispeech-releases-first-custom-chip/
----
Photonic chip artificial intelligence to help "China chip" for overtaking
光子人工智能芯片助“中国芯”换道超车
2019-01-06 00:34 Beijing News
Operators force is 1000 times faster than traditional electronic artificial intelligence chip, but only one percent of its power consumption, low latency also anti-electromagnetic interference by university doctoral Tsinghua University, Peking University, Beijing Jiaotong University and other research and development of entrepreneurship photon artificial intelligence chip technology the realization of a lot of breakthroughs in the future can be widely used in mobile phones, autopilot, intelligent robotics, unmanned aerial vehicles and other fields. Recently, the photonic chip artificial intelligence project located in Shunyi, will this new technology to the fore.
"Chip design, processing, packaging, testing all completed in China, free from dependence on foreign high-lithography process is the core technology of the lane change chips overtaking." Research team leader Bai Bing said.
http://china.qianlong.com/2019/0106/3043670.shtml
----
Gowin Semiconductor Corp.’s Cumulative Shipments Reach 10 million pieces
January 02, 2019 21:00 ET | Source: GOWIN Semiconductor Corp.
SAN JOSE, Calif. and GUANGZHOU, China, Jan. 02, 2019 (GLOBE NEWSWIRE) -- Gowin Semiconductor Corp. (hereinafter referred to as "Gowin"), the world’s leading innovator of programmable logic devices, announces that its cumulative shipments have reached 10 million pieces. Among them, Gowin’s overall device sales in 2018 exceeded 8 million units, 8 times greater year over year compared to 2017.
In January 2017, Gowin shipped hundreds of FPGA devices for the first time. Since then, Gowin’s sales volume kept surging. By October 2018, the sales volume exceeded 1.2 million units per month. By the end of 2018, the annual sales volume exceeded 8 million pieces.
Up to now, Gowin has more than 400 FPGA customers worldwide, including more than 150 customers in Asia Pacific (China mainland excluded), Europe, and the United States. Customer markets cover a wide range of areas including communications, industrial, medical, LED display, video, broadcast, Internet of Things, artificial intelligence and consumer electronics.
"This is a very important milestone for us," said Jason Zhu, CEO of Gowin Semiconductor Corp. "Gowin is still in the early stage of development and we are very happy to achieve such results. This fully proves that our innovative and differentiated design ideas work. We will continue to make breakthroughs in product and technology innovation, and look forward to achieving further success in 2019."
https://globenewswire.com/news-rele...lative-Shipments-Reach-10-million-pieces.html
-------
high-performance anti-radiation hardened DSP chip released
数字信号处理芯片 “即墨芯”正式发布
11:03 on January 6, 2019
https://news.sina.com.cn/c/2019-01-06/doc-ihqfskcn4484772.shtml
----
First ToF Imager from China - image-sensors-world
Wuhan, China-based Silicon Integrated Inc. unveils SIF2310 that it calls "The first back-illuminated area array ToF sensor in China."
The SIF2310 integrates:
- HVGA (480x360) ToF pixel array
- signal generator modulating the IR source
- 12bit ADC
- on-chip temperature sensor
- logic control unit, high-speed clock
- MIPI interface
Last edited: