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Opinionated - China Chipping Away to Semiconductor Dominance

China integrated circuit industry sales reach 97.3 bln USD in 2018
Source: Xinhua| 2019-04-09 14:34:58|Editor: Liangyu

SHENZHEN, April 9 (Xinhua) -- China's integrated circuit (IC) industry sales reached 653.2 billion yuan (about 97.3 billion U.S. dollars) in 2018, according to an official with the Ministry of Industry and Information Technology (MIIT).

The industry's compound annual growth rate from 2012 to 2018 was 20.3 percent, nearly three times the global average, said Ren Aiguang, who heads the IC office in MITT, at a meeting held in the southern city of Shenzhen.

The industry also saw a better structure with the sales share of IC design and manufacturing increasing and that of IC packing and testing shrinking in 2018, Ren said.

Despite the progress, Ren noted mid-range and low-end products still occupy a large share in the IC design market and the industry still lags behind in storage manufacturing compared with global leaders.
 
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China's Chip Sales Rose One-Fifth to USD97.3 Billion Last Year

DOU SHICONG
DATE : APR 10 2019/SOURCE : YICAI

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China's Chip Sales Rose One-Fifth to USD97.3 Billion Last Year

(Yicai Global) April 10 -- Sales in China's integrated circuit sector rose over one-fifth to CNY653.2 billion (USD97.3 billion) last year, according to official data.

The growth was supported by a balanced industry chain and a more optimized structure, state-backed Xinhua News Agency reported industry ministry official Ren Aiguang as saying at the 2019 National Electronic Information Industry Work Symposium on April 8 in Shenzhen.

The compound growth rate of the country's integrated circuit industry has reached three times the world average over the past seven years, he added. Ren explained that the worldwide IC market was valued at USD477.9 billion last year and exhibited a CAGR of 7.3 percent between 2012 and 2018, while that of China was 20.3 percent over the same period.

China's IC industry continues to optimize its structure, and the spread of design, manufacturing as well as packaging and testing capabilities are more balanced. The proportion of total industry sales from design increased to 38 percent last year from 32 percent in 2012, while that of manufacturing has increased to 28 percent from 24 percent in the same period. Revenue from packaging and testing has decreased to 34 percent of the total from 42 percent.

China's IC sector has now achieved advanced seven-nanometer-designs though it is still dominated by low-end products. It will soon achieve mass production of 14-nanometer techniques, which is still two generations behind international advanced levels.

Packaging and testing capabilities are closest to the international level with high-end business making up about 30 percent, Ren added.

https://www.yicaiglobal.com/news/china-chip-sales-rose-one-fifth-to-usd973-billion-last-year
 
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9纳米线宽!我国光刻样机实现微纳器件三维光制造新突破

04-12 18:07

集微网消息(文/小北)据科技日报报道,武汉光电国家研究中心甘棕松团队采用二束激光在自研的光刻胶上突破了光束衍射极限的限制,采用远场光学的办法,光刻出最小9纳米线宽的线段,实现了从超分辨成像到超衍射极限光刻制造的重大创新。

据悉,甘棕松团队利用的是光刻胶材料对不同波长光束能够产生不同的光化学反应,让自主研发的光刻胶在第一个波长的激光光束下产生固化,在第二个波长的激光光束下破坏固化。第二束光被调制为空心光(中心光强为0),并利用第二曙光与第一束光形成的重合光斑,作用于光刻胶。这样只有第二束光空心部分的光刻胶最终被固化,从而远场突破衍射极限。

该原理其实早在2013年就被甘棕松团队验证了,但却一直面临从原理验证样机到可商用化的工程样机的开发困难。

据科技日报报道,甘棕松团队克服了材料、软件、零部件国产化三大难题。开发了多类光刻胶、实现了样机系统关键零部件国产化,实现了微纳三维器件结构设计和制造软件一体化。甘棕松说,我们打破了三维微纳光制造的国外技术垄断,在这个领域,从材料、软件到光机电零部件,我们都将不再受制于人

双光束超衍射极限光刻系统目前主要应用于微纳器件的三维光制造,未来随着进一步提升设备性能,在解决制造速度等关键问题后,该技术将有望应用于集成电路制造(校对/春夏)

解决了激光精密制造分辨率和三维制造能力难以调和的重大问题,获得低成本的三维激光纳米制造技术。甘棕松等提出了远场突破光学衍射极限实现纳米尺度精密制造的双光束诱导-抑制方法。该方法中一束高斯光作用于材料,诱导材料发生物理化学性能变化;另一束特殊调制后的光具有空心光强分布特性,这束光和第一束光聚焦光斑中心在空间重合,并同时作用于材料,用以抑制材料发生第一束光诱导发生的物理化学性能变化。最终作用结果是仅该空心光斑中心部位地方的材料能够被第一束光诱导出性能变化,因而被制造的区域尺寸更小,制造的分辨率更高。建立了基于该方法的远场超衍射极限激光精密制造的动力学理论模型(Opt. Express 2012, 20, 16871-16879);并将理论付诸实验,将双束可见光聚焦到材料内部,实现了创纪录的单线9 nm 线宽,双线52 nm中心间距的远场激光三维光刻技术(Nature Communications 2013,4, 2061,ESI高被引论文),从实验上证实了激光制造的分辨率能够远场突破光学衍射极限,并具有理论上无限提高的可能。该成果被Nature Nanotechnology杂志以题为“Nanoscale features in 3D”专稿评论):“该方法使得(激光制造)的特征尺寸和分辨率突破了光的衍射极限(This approach allows feature sizes and resolutions to be achieved well below the diffraction limit)”。由于甘棕松所开发的该技术具备应用于半导体芯片制造的巨大前景,该技术得到了国内众多媒体的报道,并认为该技术有望实现具有自主知识产权的国产光刻机的巨大突破。

@Bussard Ramjet India? :woot:

诺存微电子国内首批高速NOR闪存芯片产品发布

来源:东方网

2019-04-12 17:02:08

2019年4月9日-11日第九十三届中国电子(CEF)展盛大开幕,由启迪控股旗下启迪融智基金和启迪阳明基金领投的苏州诺存微电子在昆山团体展中亮相,诺存微电子团队主导研发的国内首批Octa-SPI/Quad-SPI含DTR功能的高速NOR闪存芯片新品一经发布,便引起了业界人士和专业观众的高度关注。

本次诺存发布的三款产品,采用Octa-/Quad-SPI DTR高速接口技术,引脚少, SOP16、SOP8 或 BGA24封装,属国内首创;与传统SPI NOR完全兼容,但速度快16倍,可轻松实现产品升级替换SPI NOR,是汽车、物联网、工业、消费电子等应用的最佳选择。

1904121703411684464013.jpg


国家工信部电子司副司长吴胜武莅临参观指导,对公司及产品情况进行深入了解,诺存微电子就高速NOR闪存系列进行产品展示。吴胜武对诺存微电子专注发展国内自主知识产权的闪存芯片表示支持和鼓励,未来希望诺存微电子能有所突破,更上一层楼!

19041217034618456865.jpg


“脚踏实地,志存高远,致力于打造国际的闪存芯片”是诺存一直坚持的目标,未来诺存将以独特的专利技术冲击市场,引领技术创新,填补国内空白并带动相关产业的聚集效应,打造世界一级的芯片设计,让我们拭目以待!

新品解读

1、NM25L256FVA256Mb,3V,SPI/Octa-SPI; DTR NOR Flash

Protocol Support - Single I/O and Octa I/O

Single and Double Transfer Rate (STR/DTR mode)

Performance: Up to 104 MHz in clock frequency,maximum 208 MB/s read throughput (DTR mode).

Interface: Standard single SPI interface and octal SPIinterface, to enable a high degree of flexibility, performance and backwardcompatibility.

Single Supply Voltage: voltage range 2.7–3.6V. Low EnergyConsumption.

Package Options: JEDEC, SOP16 and BGA24 (5╳5 ball array), drop-in-Replacement for SPI. RoHSCompliant and Halogen Free.

Temperature Range: Full industrial (–40°C to 85°C) and in-future automotive AEC-Q 100 (–40°Cto 105°C) temperature support to address variety of applications

Security: Hardware and software block protection; onetime programmable region

Cycling endurance and Data retention: Minimum 100,000 Program/Erase Cycles; 20-year dataretention typical.

1904121703501046457248.jpg


2、NM25Q128FVB128Mb, 3V, SPI, Dual/Quad-SPI,QPI; DTR NOR Flash

Protocol Support - Single I/O, Dual I/O and Quad I/O

Single and Double Transfer Rate (STR/DTR mode)

Performance: Up to 104MHz in clock frequency, maximum 104 MB/s read throughput (DTR mode).

Interface: Standard Single,Dual and Quad SPI interface, toenable a high degree of flexibility, performance and backward compatibility.

Single SupplyVoltage:voltagerange 2.7–3.6V. Low Energy Consumption.

Package Options: JEDEC, SOP 8,drop-in-Replacement for SPI. RoHS Compliant and Halogen Free.

Temperature Range:Full industrial(–40°C to 85°C) and in-future automotiveAEC-Q 100 (–40°C to 105°C) temperature support to address variety ofapplications.

Security: Hardware and software block protection; onetimeprogrammable region

Cycling endurance and Data retention: Minimum 100,000 Program/Erase Cycles;

20-year data retention typical.

190412170355709562778.jpg


3、NM25Q64FVB64Mb,3V,SPI,Dual/Quad-SPI,QPI;DTR

Protocol Support - Single I/O, Dual I/O and Quad I/O

Single and Double Transfer Rate (STR/DTR mode)

Performance: Up to 104MHz in clock frequency, maximum 104 MB/s read throughput (DTR mode).

Interface: Standard Single,Dual and Quad SPI interface, toenable a high degree of flexibility, performance and backward compatibility.

Single Supply Voltage: voltagerange 2.7–3.6V. Low Energy Consumption.

Package Options: JEDEC, SOP 8,drop-in-Replacement for SPI. RoHS Compliant and Halogen Free.

Temperature Range:Full industrial (–40°Cto 85°C) and in-future automotiveAEC-Q 100 (–40°C to 105°C) temperature support to address variety ofapplications

Security: Hardware and software block protection; onetimeprogrammable region

Cycling endurance and Data retention:Minimum 100,000Program/Erase Cycles;

20-year data retentiontypical.

190412170402587851508.jpg


创始人介绍:

诺存微电子2015年入驻启迪科技园(昆山),创始人彭海兵博士本科毕业于清华大学,是哈佛博士、UC伯克利博士后;在半导体、纳米技术、新材料、存储器等领域取得了世界领先水平的重要成果:

代表性论文包括20篇第一/通讯作者文章,单篇论文最高被引用超350次,4篇分别被引过百次。

14项美国/中国专利,其中三项被产业化; 入选2017年江苏省“双创计划”人才、2017年“江苏留学回国人员创新创业计划”、2016年苏州“姑苏双创领军人才”和“昆山双创领军人才”。
 
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国科微发布的GK2302 SSD控制芯片,开启芯片国产化新标准
来源:中国闪存市场 编辑:AVA 发布时间:2019-04-22 15:49

4月22日下午,国科微与龙芯中科达成战略合作,并发布了国内首款全国产固态硬盘(SSD硬盘)控制芯片-全新的GK2302系列芯片,双方将建立长期稳定的业务合作伙伴关系,携手打造关键信息基础设施国产化生态。

根据协议,国科微和龙芯中科决定进一步深化合作,龙芯中科在后续主板方案上将国科微作为首选国产固态硬盘供应商,国科微则在后续芯片产品中将龙芯中科作为嵌入式CPU IP核首选供应商。作为首个战略合作成果,国科微发布了全新的GK2302系列芯片,搭载龙芯嵌入式CPU IP核,成为国内首款真正实现全国产化的固态硬盘控制芯片。

untitled.png


据悉,国科微发布的GK2302系列芯片采用高速SATA 6Gbps接口,读写速度达到500MB/s。容量最大支持4TB。相比上一代产品,GK2302的性能提升15%,功耗降低6.5%,全硬盘性能提升18.4%,将为客户提供高性能、高安全、高可靠的存储解决方案。

自2014年发布《国家集成电路产业发展推进纲要》,到2019年政府报告中指出,加大基础研究和应用基础研究支持力度,强化原始创新,加强关键核心技术攻关。国家、企业、个人等数据和信息的安全存储,以及推进国产化存储发展,已升级成为国家战略,核心技术的自主研发也已成为企业重要的战略部署。

国科微发布的GK2302系列重新定义了芯片国产化的4个标准:第一,搭载国产嵌入式CPU IP核;第二,从芯片设计到流片再到生产封装等各个环节全部在国内完成;第三,与国产整机品牌实现全面适配;第四,集成国密加解密算法,安全可信。

国科微董事长向平表示,集成电路国产化事业关系国家网络安全,是一项战略性工程,需要凝聚各方力量共同打造国产化生态。今天,国科微和龙芯中科的战略合作迈出了国产生态的一小步,未来,国科微将继续与以龙芯中科为代表的的国产化生态产业链上下游企业合作,共同打造一个高水平、高质量的产业生态,服务国家信息安全战略。

龙芯中科总裁胡伟武在致辞中表示,通用CPU、操作系统和存储设备是国家信息安全产业的基础环节,但长期以来处于薄弱态势的局面,不仅使得我国信息产业受制于人,更令国家安全也面临隐患。希望通过此次龙芯中科和国科微的强强联合,尽快打破这一局面,尽早实现国产化事业目标,实现信息安全产业的高质量发展。

中国是一个电子产品消费大国,大约占据30%左右的需求市场,然而中国核心芯片主要依赖于进口,尤其在存储芯片领域。随着国家政策的支持,除了国科微,也越来越多的芯片设计公司前赴后继的踏上自主技术创新的征途。
 
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I think people fail to understand that China can make memory and CPUs. The problem is making it competitively. One good example my Huawei acquaintance told me was a chip, it is made by Chinese companies which by theory is on par with exports and the price is almost the same with imports. Huawei chose an established import due to risk issues since the price was almost the same. The issue here is track record and brand recognition. But the situation is changing, Chinese private companies are now more willing to use and improve domestic chips due to strategic concerns. Of course the military had long known this issue, now the private sector is waking up
 
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国科微发布的GK2302 SSD控制芯片,开启芯片国产化新标准
来源:中国闪存市场 编辑:AVA 发布时间:2019-04-22 15:49

4月22日下午,国科微与龙芯中科达成战略合作,并发布了国内首款全国产固态硬盘(SSD硬盘)控制芯片-全新的GK2302系列芯片,双方将建立长期稳定的业务合作伙伴关系,携手打造关键信息基础设施国产化生态。

根据协议,国科微和龙芯中科决定进一步深化合作,龙芯中科在后续主板方案上将国科微作为首选国产固态硬盘供应商,国科微则在后续芯片产品中将龙芯中科作为嵌入式CPU IP核首选供应商。作为首个战略合作成果,国科微发布了全新的GK2302系列芯片,搭载龙芯嵌入式CPU IP核,成为国内首款真正实现全国产化的固态硬盘控制芯片。

untitled.png


据悉,国科微发布的GK2302系列芯片采用高速SATA 6Gbps接口,读写速度达到500MB/s。容量最大支持4TB。相比上一代产品,GK2302的性能提升15%,功耗降低6.5%,全硬盘性能提升18.4%,将为客户提供高性能、高安全、高可靠的存储解决方案。

自2014年发布《国家集成电路产业发展推进纲要》,到2019年政府报告中指出,加大基础研究和应用基础研究支持力度,强化原始创新,加强关键核心技术攻关。国家、企业、个人等数据和信息的安全存储,以及推进国产化存储发展,已升级成为国家战略,核心技术的自主研发也已成为企业重要的战略部署。

国科微发布的GK2302系列重新定义了芯片国产化的4个标准:第一,搭载国产嵌入式CPU IP核;第二,从芯片设计到流片再到生产封装等各个环节全部在国内完成;第三,与国产整机品牌实现全面适配;第四,集成国密加解密算法,安全可信。

国科微董事长向平表示,集成电路国产化事业关系国家网络安全,是一项战略性工程,需要凝聚各方力量共同打造国产化生态。今天,国科微和龙芯中科的战略合作迈出了国产生态的一小步,未来,国科微将继续与以龙芯中科为代表的的国产化生态产业链上下游企业合作,共同打造一个高水平、高质量的产业生态,服务国家信息安全战略。

龙芯中科总裁胡伟武在致辞中表示,通用CPU、操作系统和存储设备是国家信息安全产业的基础环节,但长期以来处于薄弱态势的局面,不仅使得我国信息产业受制于人,更令国家安全也面临隐患。希望通过此次龙芯中科和国科微的强强联合,尽快打破这一局面,尽早实现国产化事业目标,实现信息安全产业的高质量发展。

中国是一个电子产品消费大国,大约占据30%左右的需求市场,然而中国核心芯片主要依赖于进口,尤其在存储芯片领域。随着国家政策的支持,除了国科微,也越来越多的芯片设计公司前赴后继的踏上自主技术创新的征途。
China releases first original SSD controller chip
2019-04-23 11:37:02 Ecns.cn

(ECNS) -- Goke Microelectronics and Loongson Technology jointly released China's first homegrown SSD controller chip "GK2302 series" in Beijing on Monday.

The two leading Chinese chip designers unveiled their agreement for strategic cooperation, pledging to use each other's products in future research and development.

The controller chip is powered by the homegrown processor Loongson, the brand name for China's first self-developed general purpose microprocessor.

Ni Guangnan, an academician at the Chinese Academy of Engineering, said the controller chip plays a crucial role in ensuring the safety of solid-state drive storage devices, and the fully homegrown technology means it can better prevent back doors or online attacks.

Ni said he hopes that Goke Microelectronics and Loongson Technology can strengthen cooperation and develop products with higher safety and better cost performance.

Industry insiders said the breakthrough could help protect the security of China's national information strategy and reduce the cost of imports.

Development of the first Loongson chip was started in 2001 by the Institute of Computing Technology at the Chinese Academy of Sciences (CAS). In 2010, the CAS and Beijing government jointly launched Loongson Technology with the goal of promoting the commercialization of the processors.
 
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BOE leads in TV panel shipments in 1Q19 | DIGITIMES
Rebecca Kuo, Tainan; Steve Shen, DIGITIMES
Tuesday 23 April 2019

China-based BOE Technology outraced all other rivals to become the world's top supplier for TV panels in the first quarter of 2019, both in terms of unit and panel area shipments, according to data from Sigmaintell Consulting.

BOE's achievements come at the time when global TV panel shipments slid 4.5% on quarter but up 6.3% on year to 70.5 million units in the first quarter, said the China-based marketing research firm. In terms of panel area shipments, global TV panel shipments were down 4.1% on quarter but up 10.6% on year.

Buoyed by continued capacity ramps by China's players, TV panel shipments from China accounted for 46.4% of global unit shipments and 41.9% of panel area shipments in the first quarter.

Shipments from BOE alone reached 14.62 million units in the first quarter, up 16% on quarter and 17% on year. In terms of panel area shipments, BOE saw its first-quarter TV panel shipments expanded 9% on quarter and 55% on year.

With its 8.5G and 10.5G fabs operating at high capacities, BOE also served as the top vendor for TV panels in 32-, 43- 65- and 75-inch sizes in the quarter.

LG Display ranked second both in unit and panel area shipments, with its unit shipments declining 10% sequentially to 12.28 million units in the quarter.

Innolux took third position with shipments totaling 10.77 million units in the first quarter, down 15% on quarter but up 16% on year.

China Star Optoelectronics Technology (CSOT) shipped 9.4 million units in the first quarter to take fourth title. The company also served as the top vendor for 55-inch panels thanks to increased output from its 10.5G line.

Samsung Electronics followed with its shipments reaching 8.93 million units in the first quarter, decreasing 11% from a year earlier.

AU Optronics (AUO) saw its shipments remain flat at 6.27 million units in the quarter, as increased shipments of 65-inch panels were offset by reductions in other models.

Meanwhile, the average size of TV panels reached 44.5 inches in the first quarter, down 0.4 inches from a quarter earlier due to a rise of 32-inch panels as a proportion to overall shipments, Sigmaintell noted.
 
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Getting good panels for cheap is getting harder in China. More and more display makers stop selling on the open market.
 
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China's Panel Makers Ship Over Half the World's Displays for First Time
WANG ZHEN
DATE : MAY 06 2019/SOURCE : YICAI

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China's Panel Makers Ship Over Half the World's Displays for First Time

(Yicai Global) May 6 -- Though the display shipments of mainland China's panel makers were half of the world's total for the first time in the first quarter.

The shipments of mainland China's panel makers made up 50.1 percent of the world's total in the first quarter, Li Yaqin, general manager of Beijing-based tech research firm SigmaIntell Consulting, told Yicai Global.

China's panel makers shipped 33.9 percent of the world's 60-inch or larger LCD TV panels in the first quarter, London-based market research firm IHS Markit said on May 1. This means that their market share gained nearly 10 times from 3.6 percent in the first quarter of last year. In contrast, Korean producers' share fell to 45.1 percent from 54.8 percent in the same period.

The quarterly reports of domestic listed panel firms show that their revenues grew while profits dipped due to falling prices.

Beijing-based Boe Technology Group earned revenue of about CNY26.5 billion (USD3.9 billion) in the first quarter, growing 22.7 percent annually, and net profit attributable to shareholders was CNY1.05 billion, a 47.9 percent drop from the same period last year.

Shenzhen-headquartered Tianma Microelectronics achieved business income of CNY6.9 billion in the first quarter, up 5.46 percent on a yearly basis, and its net profit attributable to shareholders reached CNY289 million, down 35.4 percent from last year.

The business revenue of Beijing-based Visionox Technology in the first quarter was CNY200 million, an about rise of about 19 times, while its net loss attributable to shareholders reached CNY388 million, an annual fall of about twofold.

The rapid emergence of display production capacity in the Chinese mainland and slowing growth in market demand have produced a glut on the market, noted Bian Zheng, a senior analyst at Beijing-based All View Consulting.

his has led to steadily declining prices, so the panel makers' net profit is suffering, and this situation is unlikely to ease in the short term, he added.
 
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YMTC striving to sell own 3D NAND devices | DIGITimes
Siu Han, Taipei; Jessie Shen, DIGITIMES
Tuesday 7 May 2019

Yangtze Memory Technologies (YMTC) is set to enter volume production of 64-layer 3D NAND flash memory chips by the end of 2019, and has been in talks with parent company Tsinghua Unigroup about obtaining the right to sell and market storage devices employing the chips, according to industry sources.

YMTC originally will have Beijing Unis Memory Technology, also a Tsinghua Unigroup affiliate, sell and promote flash storage solutions such as SSDs and UFS devices powered by YMTC's in-house developed 64-layer 3D NAND chips, the sources indicated.

However, YMTC internally believes the company should own the right to sell and market its own products, namely storage devices incorporating 3D NAND chips based on its in-house developed Xtacking architecture, the sources noted.

YMTC is expected to kick off risk production of 64-layer 3D NAND flash chips as early as the third quarter of 2019, said the sources, adding that the process' production yield rate has seen significant improvement and is satisfactory enough to power consumer electronics products.

YMTC also plays a part in Longsys Electronics' plan to develop what the company claims is "100% China-made" flash storage device. Longsys has already built a close relationship with Tsinghua Unigroup according to the pair's strategic alliance signed in November 2018.

YMTC disclosed previously plans to move 64-layer 3D NAND process technology to volume production in the fourth quarter of 2019, and will move directly to the 128-layer generation with volume production scheduled for 2020.

YMTC was founded in 2016 by China's state-owned Tsinghua Unigroup, which owns 51% of the company. China's National Semiconductor Industry Investment Fund (known as the Big Fund) is among other shareholders of YMTC.
 
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Beijing-based Boe Technology Group earned revenue of about CNY26.5 billion (USD3.9 billion) in the first quarter, growing 22.7 percent annually, and net profit attributable to shareholders was CNY1.05 billion, a 47.9 percent drop from the same period last year.
I never expected BOE becoming a success, at around 6-7 years ago, it was a joke in the industry for making 160*220 screen that were poor even by a decade old standards, while receiving huge funding from every state fund imaginable.

A rare example of success when "throwing money on something until it works" ended up well
 
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May 8, 2019

Dr. Liang said, "Our FinFET technology R&D is progressing smoothly, as our 12nm is entering customer engagement, and the research and development of our next generation of FinFET is progressing well based on our accumulated technology development. The construction of SMIC South FinFET Fab was completed successfully, and we have begun capacity deployment. We will prepare ourselves to be ready for rapid transitions in customer technology migration to face the ever-changing industry environment."
 
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