TaiShang
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Taiwan is an alienable part of China, as Mainland China is.
Cooperation is only natural.
Thanks, Dotard!
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【存储器】国产化SSD真的来了
来源:嘉合劲威 2018-04-28
嘉合劲威集团携手国科微电子推出第一款国产化最高的固态硬盘,光威“弈”系列SSD终于如期而至。光威“弈”系列SSD,从主控芯片、产品品牌到生产制造均由中国企业完成。从产品命名到风格定位再到包装设计也均为中国元素。存储产品高度国产化,它的意义和影响都非常重大。
国产主控
国科微是国家规划布局内的重点集成电路设计企业和首家获得国家集成电路产业投资基金注资的集成电路设计企业,也是中南地区规模最大的集成电路设计企业之一。在2017年下半年国科微发布了拥有自主知识产权的第二代存储产品主控GK2301,迅速进入了产品应用阶段。GK2301主控是国内首款获得国测,国密双重认证的主控。
中国制造
嘉合劲威是国内高端存储芯片测试企业,拥有记忆体模组厂并设立记忆体产品实验室。2017年自主研发了FLASH、DRAM芯片测试系统。今年再次推出了“存储成品自动测试化方案”,彻底解决了存储产业自动化生产两个最大的难题,2018年实现了中国存储产品制造的智能化升级。
国产品牌
光威“弈”系列SSD的做工非常精良,采用了国科微的主控GK2301,由嘉合劲威集团深圳工厂倾心打造。
国科微、嘉合劲威选择光威,既是因为光威品牌在国内有着良好的口碑与影响,也是希望帮助中国存储品牌落地,推动国产SSD品牌的崛起。国产SSD品牌的逐渐成长,未来将为国内消费者带来更多的实惠。
光威-弈系列SSD,由嘉合劲威与国科微联合出品,无论在技术上还是市场端都给予了高度的支持。只有这样的协作才能让中国制造道路越走越宽。
在过去,国外品牌的SSD充斥市场,价格昂贵。而由于国产SSD因为主控和FLASH均来自国外,国产SSD无法形成有力的竞争。因此国内相关企业和消费者迫切的希望主控、芯片以及高度国产SSD的到来,国产存储乃国之重器。
@Bussard Ramjet
Flash Memory from YMTC (unigroup)Where are they getting their Flash Memory from?
Also, in the english translation, as far as I can understand, they have made no claims on the actual memory. It seems this product is just made by a company who has done the system integration part, not the core memory itself.
I don't know how much market share this will take away, let's see. Only market share can give a picture on how competitive this SSD is.
What does this mean? It is not even a text, that can be translated. An english summary please.
http://news.sgst.cn/zxy/yfzx/201805/t20180509_684290.html
SMIC to start risk production of 14nm FinFET process in 1H19
Cindy Yu, Taipei; Willis Ke, DIGITIMES
Friday 11 May 2018
Semiconductor Manufacturing International Corp (SMIC), the largest China-based foundry house, will kick off risk production of its 14nm FinFET process and venture into the AI (artificial intelligence) chip sector in the first half of 2019 after entering volume production of 28nm HKC+ process in the second half 2018, according to the firm's co-CEO Liang Mong-song.
Liang said at a recent investor conference that SMIC will see an upper single-digit shipment ratio for 28nm process for the whole 2018, with the volume production of its 28nm HKC process to run close to that of its 28nm Poly-SiON process.
In terms of mature process platforms, Liang highlighted the performance upgrades of power management IC process platform, saying that capacities at all its 8-inch wafer fabs are running tight to meet ever-increasing demand for power management ICs including IGBT devices. He added that the high-voltage BCD (bipolar CMOS DMOS) process will be shifted to 12-inch fabs.
Liang also stressed that SMIC will step up its technological developments, aiming to build a comprehensive process platform integrating technologies, IP and design services. In particular, he disclosed, SMIC will move to develop complete AI-based ASIC IPs in the first half of 2019 to provide customers with total IC design solutions.
Sequential 7-9% revenue growth for 2Q18
On the same occasion, another co-CEO Zhao Haijun said SMIC posted better-than-expected revenue performances, continuous growth in market demand and increased capacity utilization in the first quarter of 2018.
Zhao said SMIC raked in revenues of US$831 million for the quarter, including revenues from photomask production, wafer test and other technology royalty incomes. The quarter's gross profits reached US$220.2 million for a margin rate of 26.5%. The company expected a sequential 7-9% revenue growth for the second quarter of 2018, with gross margin to be in the range of 23-25%.
SMIC has expanded the capacity at its 8-inch fab in Shenzhen to 447,750 wafers in the first quarter of 2018 from 442,750 of a quarter earlier, and the average capacity utilization rate has risen to 88.3%.
SMIC posted R&D expenses and capital expenses at US$123 million and US$322 million, respectively, for the first quarter of 2018.
Zhao also disclosed that SMIC now sees 40% of its revenues from the China market, and is in a good position to benefit from the growing popularity of consumer electronics and IoT devices.
In particular, he stressed, SMIC has led in providing foundry services for makers of power management ICs and image sensing devices, and will enjoy a 30% growth in the NOR/NAND flash foundry business in 2018.
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another unicorn
chinamoneynetwork.com
Chinese AI Firm Unisound Raises $100M Series C Round Led By China Electronics Health Fund – China Money Network
2-3 minutes
UniHome is one of Unisound's solutions that enable home appliances to be "smart". For example, Unisound powers the voice command functions for refrigerators produced by some Chinese brands.
Chinese artificial intelligence (AI) solution provider Unisound announced that it has raised a US$100 million series C round led by China Electronics Health Fund, a fund established by China Electronics Corporation Data (CEC Data), one of China’s biggest telecommunications equipment maker.
Chinese Internet security firm 360 Technology Co. Ltd., Qianhai Wutong Mergers and Acquisition Funds, and Hanfor Capital Management Ltd, an private equity arm of Hanfor Holdings Ltd., also participated in the round, according to Unisound’s announcement on its officiel WeChat account.
Founded in 2012, Beijing-based Unisound provides voice recognition, language processing and big data solutions to Internet of Tings (IoT) devices such as home appliances, automobiles, healthcare and education products. This month, the firm will release its AI chip, which it has spent three years developing for IoT.
"Unisound has leading AI and chip technologies that have been tested by a large number of customers. Its smart medical solutions also matches China Electronics Health Fund’s investment strategy. We will work on voice recognition in the medical industry and co-develop new products and property rights to target AI chips for the healthcare industry," said China Electronics Health Fund.
The proceeds of this round will be used for research and development for AI technologies and chips, as well as business expansion, Unisound said in the announcement.
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uniOne chip for audio processing from unisound is an integrated AI ASIC+DSP. all chip cores are created by them.
Few points for people who don't know much about the industry:
- SMIC has now been promising 14nm FinFET production for many years. You can go back in this very thread to look up all their past claims, none of which have come to any fruition.
- Even if one were to take their claim as they say it, it is risk production in 1H19. Actual commercial mass production should be expected only in late 2019, or even 2020.
- TSMC has already started production for 7 nm, and will begin production for 3 nm node by 2020. This means that SMIC will be 3-4 generations behind TSMC.
- Claiming an AI ASIC, and DSP is different than making one that is competitive in the market and technologically advanced enough. I will reserve my judgement, until the product actually gains market share.