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Opinionated - China Chipping Away to Semiconductor Dominance

Nothing surprising when our dear Indian friend having special love for China and Chinese
The only problem is that he inspect any "negative issue" of China economy with a "Magnifying Glass"
So resulting "99%" if not "100%" of his threads or posts were ending up as Chinese "Economy Doomsday"

Anyway on topic, as long as we Chinese continue to improve, be it in commerce or everything going forward
We should be fine:china:thanks for the OP "Kind Concern"
 
Large Investments Intensifying Competition among Korea, China and Japan

Korean, Chinese and Japanese semiconductor manufacturers are fiercely competing each other to take the leadership in the market.

SEOUL, KOREA

4 July 2016 - 11:45am

Cho Jin-young

Trials of taking the leadership in the semiconductor market are intensifying the competition among Korea, China and Japan.

The three are making aggressive investments. But Korea is doing that to widen the gaps with the two while China and Japan to narrow the gaps. In particular, China is threatening Korea through steady M&As based on the national support.

According to surveys by market research firms Gartner and Applied Materials on July 1, it was forecast that Samsung Electronics and SK Hynix will invest in combination over US$ 10 billion in equipment a year for the next three years. They predicted that Korean semiconductor companies will invest US$10.2 billion in wafer fab equipment (WFE) this year. The Korean semiconductor manufacturers invested US$10.36 billion in 2017, US$10.73 billion in 2018 and US$11.95 billion in 2019, respectively. The amounts add up to US$33.04 billion for three years from 2017. Here, the WFE investment means the investment in semiconductor processing equipment only. Therefore, the investment amount in entire plants including the equipment will rise. In addition, their investment volume will account for about 30 percent of worldwide WFE investment.

In actuality, Samsung Electronics is expected this year to invest in the semiconductor sector more than last year when 14.7 trillion won (US$12.7 billion) was made. According to industrial sources, the semiconductor giant has decided to invest more than 2.5 trillion won (US$21.7 billion) by shifting a production line for non-memory semiconductor production in Hwaseong, Gyeonggi Province into one for 3D NAND flash memories. SK Hynix, the second ranker in the world memory semiconductor, is planning to continue the investment more than 6 trillion won (US$5.21) this year, following last year.

China’s promotion of its semiconductor industry is gaining speed too. It was found that US$65.9 billion was invested in semiconductor plants in China over the past year. The figure is the five times Samsung Electronics’ investment in semiconductor production lines in Pyeongtaek which are called the largest semiconductor production complex in the world. Chinese capital is reaching German semiconductor equipment companies after taking over equities in US semiconductor firms. Fujian Grand Chip Investment Fund LP (FGC) took over Aixtron, a German semiconductor equipment supplier for 670 million euro last month. Earlier, China’s Tsinghua Holdings Co. invested in Marvell Technology, a US-based semiconductor company. In April, Tsinghua Unigroup purchased six-percent equities in Lattice Semiconductor.

Japan is in hot pursuit of Korea as well. Toshiba, a representative semiconductor maker of Japan is trying to catch up with Samsung Electronics by applying a new technology to NAND flash memories used in smartphones next year. It seems that Toshiba will overhaul a flash memory production line to which the new technology will be applied by using some of 860 billion yen which will be invested in its semiconductor business for the next three years.

http://www.businesskorea.co.kr/english/news/industry/15114-trilateral-competition-large-investments
 
Nothing surprising when our dear Indian friend having special love for China and Chinese
The only problem is that he inspect any "negative issue" of China economy with a "Magnifying Glass"
So resulting "99%" if not "100%" of his threads or posts were ending up as Chinese "Economy Doomsday"

Anyway on topic, as long as we Chinese continue to improve, be it in commerce or everything going forward
We should be fine:china:thanks for the OP "Kind Concern"

True bro. But our indian friend believes a country 1/3 the size of China and GDP per capita less than sub Saharan Africa can sustain 1.5 billion people . They even call it population dividend.

:sarcastic:
 
wait - all that's happening is, a company has lost some money.

this says absolutely - nothing - about what is happening with the technology.

if losing money was catastrophic, do you know how many catastrophes there would be, literally today, right now?


I am quoting an article. Not presenting my views here. The title of the thread is literally the headline.
 
Two latest Cutting-edge applications of 3D-print technology

(1) 3D-print used to produce 30-ton nuclear power plant penetration assembly

http://static.video.qq.com/TPout.swf?auto=1&vid=g0307s8lc9i

填补重型金属3D打印空白

王华明核心技术团队经过上百次实验后,在关键技术上取得了突破性进展,并在实验室成功做出了物理、化学性能皆优于锻件的核电重型装备的金属构件缩比件。

重型金属3D打印技术产业化应用的突破,在国内属于空白。在3D打印的应用领域,核电又是一块处女地。南方增材相关负责人表示,重型金属3D打印技术是一种国际首创的重型金属构件短流程、绿色、精密、数字化的增材制造新技术,可广泛应用于百万千瓦核电装备、百万千瓦超临界和超超临界火电机组,以及水电、石化、冶金、船舶等现代重大工业装备合金钢等重型金属构件的制造。

“我们在材料、设备、工艺研发设计上,整套流程都拥有自主知识产权。我们通过国家专利局检索了这个领域的所有相关信息,国内外没有发现与我们技术相似的。”朱志宇表示。

相比起传统铸造工艺,增材制造技术的优势在于“轻装备”,只要一台3D打印机,一道高温电熔的“打印”工序即可见成品。而在传统锻造工艺中,如果要制作一件50吨的核电部件,至少需要180吨的钢锭材料,放入200吨以上的电弧炉进行冶炼浇注,还要经过万吨以上机器的锻造和热处理,多达十几道工序需要耗时6个月以上。

目前,核电站的建设周期是60个月。引入增材制造技术制造重型金属构件,整个周期可以压缩到50个月。

朱志宇认为,以前发展核电站的瓶颈是造价高,因而电价也高,现在压缩周期后电价会比火力发电低;另外,南方增材瞄准的是核电装备,涉及传统重工业行业这个新技术的应用,提升了产品的性能,也提高了安全等级。

(2) 3D-print used to make aero-engine(prototyping techniques for gradient transition dissimilar titanium alloys TA15 and Ti2AINb)

中国激光3D打印技术实现新突破 或用于制造发动机

2016年07月06日 综合

资料图:中国将用3D打印造军用发动机

  近日,中国航天科工三院306所技术人员成功突破TA15Ti2AlNb异种钛合金材料梯度过渡复合技术,其采用激光3D打印试制出的具有大温度梯度一体化钛合金结构进气道试验件顺利通过了力热联合试验。

  该技术成功融合了激光3D打印与梯度结构复合制造两种工艺,解决了传统连接方式(如法兰连接、焊接等工艺方法)带来的增重、密封性差和结构件整体强度刚度低等问题,为具有温度梯度结构的开发设计与制造开辟了新的研制途径;同时,开创了一种异种材料间非传统连接的制造模式,实现了结构功能一体化零部件的设计与制造。

http://mil.news.sina.com.cn/china/2016-07-06/doc-ifxtsatn8227381.shtml

@Bussard Ramjet
 
Most takeover is not intend to see immediate result or for profit for that matter. It is mainly to buy IP asset.
 
China Further Fortifies Its Semiconductor Sector With Formation of High-End Chip Alliance

Published: Aug 08,2016


1514346780.jpg


With the government’s backing, key enterprises in China’s semiconductor sector have just established a “high-end chip alliance” that fosters the formation of a vertically integrated industry ecosystem on a national scale.

The founding 27 members of this alliance include Tsinghua Unigroup, Yangtze River Storage Technology, SMIC, Huawei, ZTE and China Academy of Telecommunication Research (a branch of the country’s Ministry of Industry and Information Technology, or MIIT).

“This alliance of government, academia and industry aims to create a complete ecosystem for domestic semiconductor manufacturers, said Jian-Hong Lin, research manager of TrendForce. “If successful, the alliance will create a chip industry chain starting from chip architecture to chip production, operation systems, devices, platforms and finally to the IT service market. In sum, this move is another indication of China’s ambition to transform itself from a major manufacturing country by export volume to a global manufacturing leader in terms of product quality.”

Lin added: “The mission of China’s high-end chip alliance is to develop highly localized and vertically integrated relationships among industry players. The ecosystem they built will be exclusively for domestic manufacturers and design houses. This approach differs from the development of Taiwan’s semiconductor sector, where participants are highly specialized in their own fields and actively seek partnerships on the global market. The Chinese expect their development strategy to be advantageous because there are currently few innovations in the chip industry in terms of product development. Under this situation, vertical integration within the national context drives the division of labor and technological progress. Moreover, vertical integration generates demand and expands the market and applications for semiconductor solutions.”

Lin also sees the formation of China’s high-end chip alliance as another warning to Taiwan’s semiconductor sector: “Taiwanese semiconductor companies cannot survive on just the demand from the domestic market and compatriot electronics brands. This is especially true for the local IC design houses. Their long-term growth will depend discovering new sources of demand and application needs in the international market. Still, China currently is the largest market and has the largest client base for Taiwanese IC design houses. Whether Taiwanese IC industry is allowed to form effective joint ventures or strategic partnerships with the Chinese counterpart is an issue that Taiwan’s government and technology enterprises need to address after the establishment of the high-end chip alliance in China.”

Furthermore, this Chinese industry alliance is not simply a team headed by the government to promote the purchase of domestically made semiconductor components.

“It will take time to understand the full implication of the cooperation between academia and industry,” said Lin. “The high-end chip alliance could become an important platform for application development. To reach that goal, however, requires the Chinese semiconductor sector to overcome several challenges.”

According to Lin, the high-end chip alliance will have to help remove several hurdles to speed up vertical integration and basic R&D.

Lin first pointed out that cooperation among Chinese semiconductor and technology companies is difficult to realize.

“For instance, Chinese chip makers Spreadtrum and RDA Microelectronics are still operating independently even though they have been acquired by Tsinghua Unigroup. Consolidating resources of two subsidiaries within a company is hard, but creating cross-industry alliances are even more challenging. Spreadtrum and Huawei’s IC subsidiary HiSilicon, for example, have developed chip products based on the 16nm process technology. Major Chinese chip manufacturer SMIC, on the other hand, produces on a less advanced process technology. Spreadtrum and HiSilicon therefore will not be able to pursue the most advanced technology when working with SMIC. Similarly, SMIC has to make adjustments to work with domestic equipment and material suppliers that have yet to catch up to its level of technological maturity. Hence, the high-end chip alliance needs to set goals and incentives for the various industry participants as to make concrete progress.”

Effective teamwork furthermore involves concrete, step-by-step plans. Once chip-related IPs have been developed, their introductions into different applications, such as PCs, smartphones and IoT devices, must be carefully selected and prioritized. To create significant benefits for the entire Chinese semiconductor sector, the high-end chip alliance needs to draw up a clear and comprehensive industry roadmap. Otherwise, its members will be without coordination and pursue their own agendas.

“IC companies compete on an international level, so China’s semiconductor sector needs international resources to accelerate its development. Recently, China has been active in seeking membership in international organizations related to semiconductor trades. For example, the position of chairman of the board of directors for Global Semiconductor Association (GSA) is currently held by Dr. Leo Li, Spreadtrum’s chairman and CEO. Also, C-Sky Microsystem and Huawei became board members of Embedded Microprocessor Benchmark Consortium (EEMBC) earlier this year. These events are all important milestones of progress for China’s semiconductor sector.” Lin said.

http://en.ctimes.com.tw/DispNews.asp?O=HK08892PJQ4SAA00ND
 
SMIC is doing great! :enjoy:

Chip foundry SMIC blows past market estimates with record US$690m Q2 revenue

Net profit for the three months also rises 27pc to US$97.6 million, the company’s 17th consecutive quarter of profitability

PUBLISHED : Thursday, 11 August, 2016, 11:25am
UPDATED : Thursday, 11 August, 2016, 11:02pm

Semiconductor Manufacturing International Corp (SMIC), mainland China’s largest contract chipmaker, says it is ramping up production capacity to meet fast-growing demand in the second half of this year, following the company’s strongest quarterly results to date in the three months to June.

“We’re seeing strong demand from Chinese system houses and customers in Europe,” SMIC chief executive Chiu Tzu-yin said in conference call with analysts on Thursday.

“We are guiding another strong quarter of growth in the third quarter, and target continued growth in the fourth quarter, contrary to seasonality, and another record year for 2016,” he said.

The Shanghai-based company expected LFoundry, the Italian integrated circuit manufacturer it bought recently for €49 million (HK$421.5 million), to significantly raise overall fabrication capacity over the next three to four quarters.

Net profit for the three months ended June 30 rose 27 per cent to US$97.6 million, up from US$76.7 million in the same period last year, on robust demand from Chinese “fabless” companies – firms that design chips and outsource their production to semiconductor foundries like SMIC.

“This marked our 17th consecutive quarter of profitability,” Chiu said, adding the firm’s capacity utilisation rate also reached 98 per cent in the period.

Gross margin was 31.6 per cent last quarter, compared to 32.3 per cent a year earlier, as revenue increased 26 per cent to a historical high of US$690.2 million from US$546.6 million the previous year.

Jefferies equity analyst Ken Hui said SMIC’s net profit was 54 per cent above his estimates and 47 per cent ahead of the market’s consensus forecast.

Revenue was 3 per cent above both Jefferies’ and consensus estimates, Hui said.

According to SMIC’s filing with the Hong Kong stock exchange, 52 per cent of revenue was generated from sales to customers in China, 26.5 per cent from North America, and 21.5 per cent from Europe and the rest of Asia.

Nomura analyst Huang Leping said in a report: “SMIC is operating under ideal status as a foundry with strong execution in sales and capacity expansion.”

Both Jefferies’ Hui and Nomura’s Huang identified Shenzhen-based HiSilicon, reputed to be the largest domestic designer of integrated circuits, as one of the big Chinese customers of SMIC in the second quarter.

SMIC is operating under ideal status as a foundry with strong execution in sales and capacity expansion.

Chiu said SMIC has forecast its third-quarter revenue to increase between 8 per cent and 11 per cent quarter on quarter, while its gross margin would range from 28 per cent to 30 per cent.

He added that its revenue growth target for this year would be in the mid- to high 20 per cent range, compared with the previous guidance of 20 per cent.

Jefferies’ Hui said SMIC’s higher revenue growth forecast this year “should include about two months of contribution from LFoundry”.

SMIC’s capacity expansion efforts received a boost last month when it completed its biggest debt offering to date. The company raised proceeds of US$441 million from its issue of US$450 million, zero-coupon convertible bonds due on 2022.

http://www.scmp.com/tech/china-tech...-blows-past-market-estimates-record-us690m-q2

@Bussard Ramjet
 
Over 70% domestic market. About 30% international.

Wait, do I really read this right?

You are saying that NMC holds a 30% market share globally in this segment? (I am not asking about the breakage of companies revenues, but its share in the global market.)

How does it compare with giants like Applied Materials, Lam Research etc?
 
Wait, do I really read this right?

You are saying that NMC holds a 30% market share globally in this segment? (I am not asking about the breakage of companies revenues, but its share in the global market.)

How does it compare with giants like Applied Materials, Lam Research etc?

I pretty sure. We are talking about etchers not lithography machines on which China is also working strenuously:

http://www.ioe.ac.cn/xwdt/zhxw/201604/t20160407_4579957.html

SP lithography machine prototype, 22nm single-shot imaging, 10nm or below multiple exposures.

Hope they can commercialize the new principle machine as soon as possible. :D:D
 
http://semiengineering.com/chinas-capital-equipment-market-to-boom/
China’s Capital Equipment Market To Boom
The country’s “Made in China 2025” plan should benefit equipment suppliers, foreign and domestic.

August 18th, 2016 - By: Jeff Dorsch

Untitled.png


The worldwide semiconductor capital equipment market declined 3% last year to $36.53 billion from 2014’s $37.5 billion, but inside China the story was significantly different. Capital equipment sales there increased by 12% in 2015, to $4.9 billion.

In fact, only Japan showed a higher growth rate last year, of 31%, according to figures from SEMI and the Semiconductor Equipment Association of Japan.​

Of course, it should be noted that China (Mainland) was the 5th-largest market for semiconductor production equipment during 2015, trailing Taiwan, South Korea, Japan, and North America (US, Canada, Mexico), in that order. Still, the potential market growth for China is tremendous, owing to the “Made in China 2025” plan adopted last year by the national government.​

China’s trade deficit in chips is currently about $150 billion a year. The country is the world’s largest importer of semiconductors due to its sizable industries in consumer electronics and contract electronics manufacturing, fed by dozens of outsourced semiconductor assembly and testing (OSAT) companies.

The 2025 plan calls for China to bulk up in all areas of chip design and manufacturing – more IC design firms and fabless semiconductor companies, more silicon foundries, more manufacturers of logic and memory chips, more OSATs, and more vendors of semiconductor capital equipment. The goal is to reduce the country’s severe dependence on chips and semiconductor manufacturing equipment from abroad.

In recent years, the government has subsidized production of light-emitting diodes for lighting systems, backlighting for LCD televisions, and other applications. It felt constrained by the fact that most of the metal-organic chemical vapor deposition (MOCVD) reactors used to make LEDs in China were supplied by Taiyo Nippon Sanso of Japan, and Aixtron of Germany. The PRC government has, in turn, encouraged the domestic development of MOCVD reactors — not entirely cutting off Taiyo Nippon Sanso and Aixtron — but providing an alternative supply chain for the crucial LED manufacturing equipment.

Technavio forecasts the LED production equipment market will enjoy a compound annual growth rate of more than 5%, reaching $1.5 billion in 2019. The Asia-Pacific region accounted for 86% of the LED production equipment market in 2014, the market research firm estimates, and it will increase that share to more than 88% in 2019. China will be among the countries benefiting from such growth, according to Technavio.​

China has been highly active in acquiring overseas chip companies and capital equipment vendors, while reorganizing its domestic semiconductor manufacturing for greater efficiency. A dozen or more new wafer fabrication facilities are under construction in China, with eight of them devoted to foundry services, according to Sam Wang, a research vice president at Gartner.

Tsinghua Unigroup, a government-backed entity affiliated with Tsinghua University, last month took over majority control of Wuhan Xinxin Semiconductor Manufacturing (XMC), a producer of NOR flash memory devices and CMOS image sensors that also offers foundry services. Tsinghua Unigroup formed a new holding company for XMC called Yangtze River Storage Technology, of which it owns more than 50%.

XMC previously received national funding of $24 billion to build and equip a memory chip fab.

Some of China’s new fabs were built with the cooperation of foreign chipmakers, principally Samsung Electronics, and SK Hynix, which are making 3D NAND flash memory devices and other memories.​

VLSI Research late last month perceived an industry “upturn” in global semiconductor sales.

Conditions have been steadily improving across the board in Memory, Foundry, IDM, SoC, and IoT markets with demand out of China being particularly hot with smartphone penetration on the rise,” the market research firm noted.​

“Why is China investing in the semiconductor industry?” asked Jim Walker, a research vice president at Gartner, at last month’s SEMI/Gartner Market Symposium in San Francisco. The main aim, he said, is “lowering the trade deficit.” He added, “They want to make their own semiconductors because they make all the electronics products.”

While memory fab and foundry construction is proceeding apace in China, the country continues to invest in OSATs and semiconductor assembly and test services in general, due to the lower costs of equipping IC assembly and test plants, compared with fabs.​

The U.S. Department of Commerce’s International Trade Administration wrote in a report this year,​

“All of this fab building and other upgrades/equipment purchases will result in a significant uptick in Chinese purchases of semiconductor manufacturing equipment from 2016 to 2018. Fab construction spending in China is expected to slow down in 2017, which may result in a pause in the increase of semiconductor equipment spending in 2018 to 2019, but the general trend will still be upward. China also buys a significant amount of machinery for outsourced semiconductor assembly and test (OSAT). China represents 27% of the world’s floor space for OSAT.

Gartner’s Walker noted the APAC dominance in OSAT dates back to 1962.​

“There is no high-value packaging in the U.S.,” he noted. “The last plant closed a few years ago.”

China has put a lot of effort into building up Jiangsu Changjiang Electronics Technology (JCET), now the country’s largest provider of IC packaging and testing services, and the fourth largest OSAT provider in the world, behind Taiwan's Advanced Semiconductor Engineering (ASE Global), Amkor Technology, and Siliconware Precision Industries. JCET last year acquired STATS ChipPAC, vaulting the Chinese company into the top ranks of the OSAT/SATS industry. The company was formed in 1972 as the Jiangyin Transistor Factory.​

“Other countries are threatened by China’s semiconductor goal,” Walker asserted. The U.S. Bureau of Industry and Security, another Commerce Department agency, estimates that 43% of companies engaged in original design manufacturing and SATS will be based in China.

He concluded, “Take actions in China now, as your competitors already have.”
 
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Semiconductor industry ,we are far behind SK, Taiwan, Japan and US now. But situation is slowly changing,maybe in the year 2020,we can rank 4 or 5 position. It is a bloody industry,need much much money and determination.
 

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