You think that just because DRAM, NAND, and some other devices scaled down to the low teens, that means other logic devices must be the same.
Just a sample...
https://en.wikichip.org/wiki/14_nm_lithography_process
You cannot answer my question because you have no relevant experience to speak about this subject.
Each technology node --
AT THE MASS MANUFACTURING LEVEL -- relies on the testing capability, meaning if you cannot reliably test your device at that node, you cannot manufacture. Your product lines remains at the current node.
Functional and Parametric test data are feedback to the fab, who then modify their recipes to incrementally scale down to the next planned node. Then at the planned node, if those test data are deemed statistically unreliable, you have to investigate whether it is your manufacturing processes or the test equipment cannot test your devices at that node. You are responsible for your manufacturing processes but there is nothing you can do about your test equipment suppliers. You must wait for them. If they cannot deliver, you are bound at that node.
Here are a couple test equipment manufacturers...
https://www.advantest.com/
https://www.tel.com/
The fact that Intel chose VN is a sign that VN can handle mass manufacturing at the 14 nm node, which is not obsolete for what Intel planned for that site. Further, that site can scale down when there is a need for it.
Your criticism is about denying VN due credit, not because you know what you are talking about.