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Taiwan Semiconductor Manufacturing Co., one of the world’s largest semiconductor makers, said today it will more than triple its planned investment in Arizona to $40 billion from a previously announced $12 billion. Combined, its two announced Arizona projects represent one of the largest foreign direct investments in the history of the United States, TSMC said.
The new $28 billion of funds unveiled today would be for a second facility that would use TSMC’s current leading-edge three nanometer (one billionth of a meter) process technology beginning in 2026. Its first facility is scheduled to start production in 2024.
The investment comes amid a U.S. push to boost domestic supplies of semiconductors. Congressional passage of the $52 billion CHIPS and Science Act this year is helping to attract investment in the U.S. from the likes of Intel, Samsung and GlobalFoundries. TSMC, a supplier to Apple and Nvidia among other leading U.S. tech businesses, will hold a tool-in ceremony today whose reported guests include President Joe Biden, Apple’s Tim Cook, and TSMC’s billionaire founder Morris Chang.
In addition to the more than 10,000 construction workers linked to the site, TSMC Arizona’s two projects are expected to create an additional 10,000 high-paying high-tech jobs, including 4,500 direct TSMC jobs, the chipmaker said today. The two investments will generate an estimated end-product value of more than $40 billion, it said.
Taiwan is a global leader in the supply of advanced chips but has faced increased military tension this year from Beijing, which claims sovereignty over the self-ruled, democratic, high-tech hub of 24 million people. (See related post here.) The U.S. recently announced limits on sales of chipmaking equipment and chips to mainland China amid rising geopolitical pressure between the two.
Among other Taiwan technology companies to announce U.S. investment plans, GlobalWafers, a Taiwan-headquartered supplier of wafers to the semiconductor industry, broke ground on an up to $5 billion facility in Texas on Dec. 1. It will be the first wafer plant built in the U.S. in two decades. (See related post here.) MediaTek this year announced plans to set up a design center with Purdue University in Indiana.
TSMC Arizona is in the planning stages for an on-site Industrial Water Reclamation Plant that when finished, will allow the TSMC Arizona site to achieve near zero liquid discharge, the company said.
“When complete, TSMC Arizona will be the greenest semiconductor manufacturing facility in the United States producing the most advanced semiconductor process technology in the country, enabling next generation high-performance and low-power computing products for years to come,” said TSMC Chairman Dr. Mark Liu in a statement. “We are thankful for the continual collaboration that has brought us here and are pleased to work with our partners in the United States to serve as a base for semiconductor innovation.”
The new $28 billion of funds unveiled today would be for a second facility that would use TSMC’s current leading-edge three nanometer (one billionth of a meter) process technology beginning in 2026. Its first facility is scheduled to start production in 2024.
The investment comes amid a U.S. push to boost domestic supplies of semiconductors. Congressional passage of the $52 billion CHIPS and Science Act this year is helping to attract investment in the U.S. from the likes of Intel, Samsung and GlobalFoundries. TSMC, a supplier to Apple and Nvidia among other leading U.S. tech businesses, will hold a tool-in ceremony today whose reported guests include President Joe Biden, Apple’s Tim Cook, and TSMC’s billionaire founder Morris Chang.
In addition to the more than 10,000 construction workers linked to the site, TSMC Arizona’s two projects are expected to create an additional 10,000 high-paying high-tech jobs, including 4,500 direct TSMC jobs, the chipmaker said today. The two investments will generate an estimated end-product value of more than $40 billion, it said.
Taiwan is a global leader in the supply of advanced chips but has faced increased military tension this year from Beijing, which claims sovereignty over the self-ruled, democratic, high-tech hub of 24 million people. (See related post here.) The U.S. recently announced limits on sales of chipmaking equipment and chips to mainland China amid rising geopolitical pressure between the two.
Among other Taiwan technology companies to announce U.S. investment plans, GlobalWafers, a Taiwan-headquartered supplier of wafers to the semiconductor industry, broke ground on an up to $5 billion facility in Texas on Dec. 1. It will be the first wafer plant built in the U.S. in two decades. (See related post here.) MediaTek this year announced plans to set up a design center with Purdue University in Indiana.
TSMC Arizona is in the planning stages for an on-site Industrial Water Reclamation Plant that when finished, will allow the TSMC Arizona site to achieve near zero liquid discharge, the company said.
“When complete, TSMC Arizona will be the greenest semiconductor manufacturing facility in the United States producing the most advanced semiconductor process technology in the country, enabling next generation high-performance and low-power computing products for years to come,” said TSMC Chairman Dr. Mark Liu in a statement. “We are thankful for the continual collaboration that has brought us here and are pleased to work with our partners in the United States to serve as a base for semiconductor innovation.”
TSMC Will Triple Arizona Investment To $40 Billion, Among Largest Foreign Outlays In U.S. History
Taiwan's GlobalWafers broke ground last week on a separate $5 billion investment in Texas.
www.forbes.com